Sockets for ICs, Transistors

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
126-41-640-41-003000

126-41-640-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,137 -
RFQ
126-41-640-41-003000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-640-41-003000

126-91-640-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,058 -
RFQ
126-91-640-41-003000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-950-41-001000

126-41-950-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,881 -
RFQ
126-41-950-41-001000

Datasheet

Tube 126 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-950-41-001000

126-91-950-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,231 -
RFQ
126-91-950-41-001000

Datasheet

Tube 126 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-13-650-41-780000

104-13-650-41-780000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

2,512 -
RFQ
104-13-650-41-780000

Datasheet

Tube 104 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
116-41-652-41-001000

116-41-652-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,866 -
RFQ
116-41-652-41-001000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-652-41-001000

116-91-652-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,793 -
RFQ
116-91-652-41-001000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-012-05-001001

510-93-012-05-001001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,369 -
RFQ
510-93-012-05-001001

Datasheet

Tube 510 Active PGA 12 (5 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-952-41-001000

612-41-952-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,464 -
RFQ
612-41-952-41-001000

Datasheet

Tube 612 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-952-41-001000

612-91-952-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,215 -
RFQ
612-91-952-41-001000

Datasheet

Tube 612 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
546-87-223-18-091135

546-87-223-18-091135

CONN SOCKET PGA 223POS GOLD

Preci-Dip

3,680 -
RFQ
546-87-223-18-091135

Datasheet

Bulk 546 Active PGA 223 (18 x 18) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-223-18-091136

546-87-223-18-091136

CONN SOCKET PGA 223POS GOLD

Preci-Dip

3,758 -
RFQ
546-87-223-18-091136

Datasheet

Bulk 546 Active PGA 223 (18 x 18) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-224-18-091135

546-87-224-18-091135

CONN SOCKET PGA 224POS GOLD

Preci-Dip

3,750 -
RFQ
546-87-224-18-091135

Datasheet

Bulk 546 Active PGA 224 (18 x 18) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-224-18-091136

546-87-224-18-091136

CONN SOCKET PGA 224POS GOLD

Preci-Dip

3,476 -
RFQ
546-87-224-18-091136

Datasheet

Bulk 546 Active PGA 224 (18 x 18) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-179-18-111112

614-87-179-18-111112

CONN SOCKET PGA 179POS GOLD

Preci-Dip

2,128 -
RFQ
614-87-179-18-111112

Datasheet

Bulk 614 Active PGA 179 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-179-18-112112

614-87-179-18-112112

CONN SOCKET PGA 179POS GOLD

Preci-Dip

2,215 -
RFQ
614-87-179-18-112112

Datasheet

Bulk 614 Active PGA 179 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
36-3575-10

36-3575-10

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

2,689 -
RFQ
36-3575-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6571-10

36-6571-10

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

2,801 -
RFQ
36-6571-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6572-10

36-6572-10

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

3,937 -
RFQ
36-6572-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6573-10

36-6573-10

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

3,282 -
RFQ
36-6573-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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