Sockets for ICs, Transistors

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
123-13-636-41-001000

123-13-636-41-001000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.

2,859 -
RFQ
123-13-636-41-001000

Datasheet

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
22-0511-11

22-0511-11

CONN SOCKET SIP 22POS GOLD

Aries Electronics

3,993 -
RFQ
22-0511-11

Datasheet

Bulk 511 Active SIP 22 (1 x 22) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
126-41-650-41-002000

126-41-650-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,389 -
RFQ
126-41-650-41-002000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-950-41-002000

126-41-950-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,966 -
RFQ
126-41-950-41-002000

Datasheet

Tube 126 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-650-41-002000

126-91-650-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,664 -
RFQ
126-91-650-41-002000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-950-41-002000

126-91-950-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,420 -
RFQ
126-91-950-41-002000

Datasheet

Tube 126 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-964-41-003000

116-93-964-41-003000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

2,107 -
RFQ
116-93-964-41-003000

Datasheet

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-964-41-003000

116-43-964-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,276 -
RFQ
116-43-964-41-003000

Datasheet

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-44-322-61-003000

115-44-322-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,058 -
RFQ
Tube * Active - - - - - - - - - - - - - -
116-43-310-61-008000

116-43-310-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,464 -
RFQ
Tube * Active - - - - - - - - - - - - - -
116-93-310-61-008000

116-93-310-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,145 -
RFQ
Tube * Active - - - - - - - - - - - - - -
48-6556-30

48-6556-30

UNIVERSAL TEST SOCKET 48POS

Aries Electronics

3,332 -
RFQ
- 6556 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
48-6556-20

48-6556-20

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

2,224 -
RFQ
48-6556-20

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
48-3551-10

48-3551-10

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics

3,124 -
RFQ
48-3551-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-3552-10

48-3552-10

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics

2,949 -
RFQ
48-3552-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-3553-10

48-3553-10

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics

3,371 -
RFQ
48-3553-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6551-10

48-6551-10

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics

2,011 -
RFQ
48-6551-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6552-10

48-6552-10

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics

3,940 -
RFQ
48-6552-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-3554-10

48-3554-10

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics

3,668 -
RFQ
48-3554-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6553-10

48-6553-10

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics

2,519 -
RFQ
48-6553-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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