Sockets for ICs, Transistors

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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应用所有
结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
614-43-328-41-001000

614-43-328-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,876 -
RFQ
614-43-328-41-001000

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-428-41-001000

614-43-428-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,359 -
RFQ
614-43-428-41-001000

Datasheet

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-628-41-001000

614-43-628-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,168 -
RFQ
614-43-628-41-001000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-642-41-008000

116-93-642-41-008000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.

3,761 -
RFQ
116-93-642-41-008000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-642-41-008000

116-43-642-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,303 -
RFQ
116-43-642-41-008000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-650-41-006000

116-47-650-41-006000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

2,233 -
RFQ
116-47-650-41-006000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-93-132-31-007000

714-93-132-31-007000

SOCKET CARRIER SIP 32POS

Mill-Max Manufacturing Corp.

2,254 -
RFQ
714-93-132-31-007000

Datasheet

Tube 714 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-650-41-770000

104-11-650-41-770000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,571 -
RFQ
104-11-650-41-770000

Datasheet

Tube 104 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-642-31-002000

614-43-642-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,093 -
RFQ
614-43-642-31-002000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-642-31-002000

614-93-642-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,753 -
RFQ
614-93-642-31-002000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
24-81000-610C

24-81000-610C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,485 -
RFQ
24-81000-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-81125-610C

24-81125-610C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,166 -
RFQ
24-81125-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-81150-610C

24-81150-610C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,373 -
RFQ
24-81150-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-81250-610C

24-81250-610C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,370 -
RFQ
24-81250-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-8250-610C

24-8250-610C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,732 -
RFQ
24-8250-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-8312-610C

24-8312-610C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,548 -
RFQ
24-8312-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-8370-610C

24-8370-610C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,542 -
RFQ
24-8370-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-8500-610C

24-8500-610C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,070 -
RFQ
24-8500-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-8550-610C

24-8550-610C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,720 -
RFQ
24-8550-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-8580-610C

24-8580-610C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,393 -
RFQ
24-8580-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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