Sockets for ICs, Transistors

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
24-8600-610C

24-8600-610C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,804 -
RFQ
24-8600-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-8700-610C

24-8700-610C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,841 -
RFQ
24-8700-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-8750-610C

24-8750-610C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,793 -
RFQ
24-8750-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-8900-610C

24-8900-610C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,442 -
RFQ
24-8900-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
605-41-432-11-480000

605-41-432-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

3,832 -
RFQ
605-41-432-11-480000

Datasheet

Tube 605 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-41-632-11-480000

605-41-632-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

2,833 -
RFQ
605-41-632-11-480000

Datasheet

Tube 605 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-91-432-11-480000

605-91-432-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

2,667 -
RFQ
605-91-432-11-480000

Datasheet

Tube 605 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-91-632-11-480000

605-91-632-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

2,838 -
RFQ
605-91-632-11-480000

Datasheet

Tube 605 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-322-41-002000

126-93-322-41-002000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

2,188 -
RFQ
126-93-322-41-002000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-422-41-002000

126-93-422-41-002000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

2,427 -
RFQ
126-93-422-41-002000

Datasheet

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-322-41-002000

126-43-322-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,571 -
RFQ
126-43-322-41-002000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-422-41-002000

126-43-422-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,575 -
RFQ
126-43-422-41-002000

Datasheet

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
316-93-132-41-006000

316-93-132-41-006000

SOCKET ELEVATED SIP 32POS

Mill-Max Manufacturing Corp.

2,161 -
RFQ
316-93-132-41-006000

Datasheet

Tube 316 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-13-640-41-780000

104-13-640-41-780000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

3,079 -
RFQ
104-13-640-41-780000

Datasheet

Tube 104 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
123-91-432-41-001000

123-91-432-41-001000

SOCKET IC OPEN 3 LVL .400 32POS

Mill-Max Manufacturing Corp.

2,913 -
RFQ
Tube 123 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-91-632-41-001000

123-91-632-41-001000

SOCKET IC OPEN 3 LVL .600 32POS

Mill-Max Manufacturing Corp.

3,326 -
RFQ
Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-41-952-41-001000

115-41-952-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,893 -
RFQ
115-41-952-41-001000

Datasheet

Tube 115 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-91-952-41-001000

115-91-952-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.

3,486 -
RFQ
115-91-952-41-001000

Datasheet

Tube 115 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-41-432-41-001000

123-41-432-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,750 -
RFQ
123-41-432-41-001000

Datasheet

Tube 123 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-41-632-41-001000

123-41-632-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,294 -
RFQ
123-41-632-41-001000

Datasheet

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Record«Prev1... 496497498499500501502503...1100Next»
HOME

HOME

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER